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高通骁龙处理器最新排名依次为骁龙8Gen2、骁龙8+Gen1、骁龙8Gen1、骁龙888+、高通骁龙888、高通骁龙870、骁龙865+、骁龙865、骁龙7Gen1、骁龙860等。
1、骁龙8Gen2
采用台积电4nm工艺,搭载Adreno740GPU,搭载8核CPU,超大核主频提高到3.36GHz,4大核主频为2.80GHz,3小核为2.02GHz。
2、骁龙8+Gen1
采用了三星的5nmlpe架构工艺,这也是目前最顶尖的工艺。采用了1+3+4八核的CPU架构,一个大核X1,主频为2.995GHz、三个中核A78,频率为2.42GHz、四个小核,A55运行频率为1.80GHz。
3、骁龙8Gen1
骁龙8Gen1内置八核KryoCPU,其中包括一个基于Cortex—X2的3.0GHz内核,三个基于Cortex—A710的2.5GHz高性能内核,以及四个基于Cortex—A510的1.8GHz高效内核。骁龙8Gen1芯片的制程工艺从骁龙888的三星5nm制程工艺升级到三星4nm制程工艺。
4、骁龙888+
CPU采用1×2.84GHz(ARM最新CortexX1核心)+3×2.4GHz(CortexA78)+4×1.8GHz(CortexA55),GPU为Adreno660,采用X605Gmodem基带,支持WiFi6E、Bluetooth5.2。
5、骁龙888
骁龙888基于三星5nm工艺制成,CPU采用1×2.84GHz(ARM最新CortexX1核心)+3×2.4GHz(CortexA78)+4×1.8GHz(CortexA55),GPU为Adreno660,采用X605Gmodem基带,支持WiFi6E、Bluetooth5.2。
6、骁龙870
骁龙870基于台积电7nm工艺制成,包括一颗A77(3.19GHz)超大核+三颗A77(2.42GHz)大核以及四颗A55(1.8GHz)效能核心,WIFI芯片仅支持到FastConnect6800。GPU为Adreno650。