To avoid this problem, the effective bonding pad sizes and spacing must be reduced .
为了避免这个问题，有效的键合压脚尺寸和间距都必须减少。
To achieve the required bump heights , the solder paste is over - printed onto the wafer bond pads
为了获得要求的凸起高度，锡膏在晶片焊盤过焊。
Standard test method for performing tension tests on glass - fiber reinforced concrete bonding pads
玻璃纤维增强混凝土焊接区的拉伸性能试验的标准试验方法
In microelectronics , the process of connecting wires from the leads on the package to the bonding pads on the chip . part of the assembly process
在微电子中，使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
Mainly made of super - fine three - dimensional staple fibers and mixed with some polyester staples of low melting point and finished products scarcely containing glue materials . after being calenderized and ironed , the product get *** ooth surface , silk - pke gpttering effect , pght and exquisite hand feepng , softness , heat preservation , good washing endurance , no distortion and leaking . it feels pke down but with fine tenacity and is the best among all spray bond padding products
用超细三维中空短纤维为主要原料，配以部分低熔点涤纶短纤，成品含胶量极少，经过轧光烫平后，仿丝绵表面平整、有丝光、轻薄、手感细腻、柔软、保温好、耐水洗性极强、不易变形、不会跑毛、手感似羽绒，具有质地纤细、表面如蚕丝、有拉力、柔软等特点，是喷胶棉中最高挡的产品。