【翻译】：翻转
【造句】：
The reworkable underfills technology for flip chip.
倒装芯片的可修复底部填充技术
Research on the thermode bonding procee for flip chip.
倒装芯片热电极键合工艺研究。
Implementation of flip chip and chip scale technology.
叩焊晶片和晶片标度技术的执行。
Flip chip will be a new method of packaging technology.
倒装芯片将成为封装技术的最新手段
Bump fabrication methods for flip chip.
倒装芯片凸点制作方法。
Screen printing technology for solder ball flip chip for smt.
倒装芯片及晶圆和基底凸起的网版印刷技术一。
Flip chip bonding technology used in modern micro - photoelectron package.
现代微光电子封装中的倒装焊技术。
Fcpga flip chip pin grid array.
反转芯片针脚栅格阵列。
Ic and optoelectronics packaging ; flip chip technology ; surface mount technology.
集成电路及光电子封装；倒扣芯片技术；表面贴装技术
Current research on the reaction between solder bump and under bump metallurgy systems in flip chip.
倒装芯片中凸点与凸点下金属层反应的研究现状。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
Promote the manufacture of high value - added products , e . g . wafer fabrication , flip chip technology.
增加了高附加值产品的生产，如无线电晶片、芯片等
As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps.
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。